| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve problems in that, in a case where a die is thinned, the rigidity of the die becomes extremely low compared to the adhesion of dicing tape, therefore it is difficult for the die to be released from the dicing tape, with the result that the die is liable to crack during the picking up of the die, which complicates the device configuration and hence increases cost in a known art, that is, a conventional technique does not take account of the respect of picking up a thinned die by a simple configuration.SOLUTION: The present invention comprises: a sucking part for sucking a release object, which is an object to be released from a film among a plurality of objects attached to a film; a pressing part for pressing peripheral objects around the release object; and a connection part for connecting the pressing part and the attracting part. The pressing part is formed on at least part of the periphery of the sucking part.</p> |
