| 摘要 |
The present invention relates to a heat radiation structure for an electric/electronic device, particularly, characterized in that a fin insertion hole is formed in a ceramic or aluminum plate member, which is coupled to a CPU that is used for various kinds of electric/electronic devices or a large-capacity semiconductor switching element to radiate heat, or in an aluminum or epoxy printed circuit board for a LED lighting device, and a plurality of heat radiation fins are forcibly inserted/installed into the fin insertion hole such that bottom ends of the heat radiation fins forcibly inserted into the fin insertion hole coincide with the bottom surface of the ceramic or aluminum plate member or the bottom surface of the aluminum or epoxy printed circuit board on which LEDs are directly mounted. Therefore, during driving of a LED driving device, which is widely used recently, and the like, including a CPU that is used for various kinds of electric/electronic devices or a large-capacity semiconductor switching element such as FET, TGBT, TRIAC, the large amount of heat generated by LEDs can be directly radiated via heat radiation fins having excellent heat conductivity, thereby improving the uniformity of heat radiation through the heat radiation structure and substantially increasing heat radiation efficiency by means of the free air flow between the heat radiation fins. |
