| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emission device that can achieve sufficient electric insulation and can be manufactured inexpensively through easy manufacturing processes.SOLUTION: A light emission device includes a plurality of wiring patterns, a positive electrode external connection land 12, and a negative electrode external connection land 13 while a plurality of light emitting elements are mounted on a substrate 3 having corner parts. The light emitting elements are semiconductor LED chips, the wiring patterns each include an anode wiring pattern and a cathode wiring pattern, and the positive electrode external connection land 12 and negative electrode external connection land 13 are to connect external connection wiring 14 directly, the positive electrode external connection land 12 being electrically connected to the anode wiring pattern and the negative electrode external connection land 13 being electrically connected to the cathode wiring pattern respectively. Further, the light emission device includes a light emission part having the plurality of light emission elements sealed with one sealing body 6 on the substrate 3. |
