| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component pressing device, an electronic component pressing unit, an electronic component conveyance device and an electronic component inspection device which make it possible to control the temperature of an electronic component with high accuracy.SOLUTION: A first hand unit 1 includes a base 911, a heat exchange part 912 capable of heat exchange with an IC device 100, a heat sink 914 disposed between the base 911 and the heat exchange part 912 and thermally connected to the heat exchange part 912, an injection nozzle 916 for jetting cooling gas G to the heat sink 914, and a heater 913 that heats the IC device 100. |
