| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method for a semiconductor device including an electric charge removing step for removing electric charges of an insulating film or a semi-insulating film in a termination structure.SOLUTION: An inspection method for a semiconductor device includes a first inspection step for inspecting breakdown strength of a semiconductor device in which a cell structure 10, where a main current flows, and a termination structure 12 enclosing the cell structure are formed on a substrate 14, an electric charge removing step for removing an electric charge of a surface layer 39 which is formed of an insulating film 36 or a semi-insulating film 38 on the substrate of the termination structure after the first inspection step, and a second inspection step for inspecting breakdown strength of the semiconductor device after the electric charge removing step. |
