SEMICONDUCTOR DEVICE AND MICROPHONE

摘要

A bump-joining pad (61) is provided to the upper surface of a substrate (45), and a bump (70) of a circuit element (43) is connected to the bump-joining pad. The bump-joining pad (61) is connected to a substrate-side joining section (69) provided to a surface facing a cover by a pattern wiring (64). A microphone chip (42) is mounted on the lower surface of the cover (44). A first joining pad (a bonding pad (48), a cover-side joining section (49)) is provided to a surface of the cover (44) facing the substrate (45), and the microphone chip (42) is connected to the first joining pad by a bonding wire (50). The first joining pad of the cover (44) and the substrate-side joining section (69) of the substrate (45) are joined by a conductive material (65), and as a result, the microphone chip (42) and the circuit element (43) are electrically connected.

主权项

1. A semiconductor device comprising:
a package formed from a first member and a second member, the package having a space formed inside; and a sensor and a circuit element that are accommodated inside the package, wherein a first joining pad is provided at a joining portion of the first member to the second member, wherein a bump-joining pad for connecting a bump is provided to the second member, and a second joining pad is in conduction with the bump-joining pad is provided to a joining portion of the second member to the first member, wherein one element among the sensor and the circuit element is mounted on the first member, and the one element and the first joining pad are connected by a wiring, wherein a bump is provided to another element among the sensor and the circuit element, and the bump is connected to the bump-joining pad and the another element is mounted on the second member, wherein the sensor and the circuit element are arranged while being at least partially overlapped with each other when seen from a direction vertical to a bottom surface of the package, and wherein the package is formed by joining the first member and the second member, and the first joining pad and the second joining pad are joined by a conductive material.