RESIN COMPOSITION, RESIN SHEET, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

摘要

Provided is a resin sheet which, during stress measurements made while applying dynamic shear strain in a direction parallel to the surface, at a temperature of 80°C and a frequency of 0.5 Hz, exhibits a difference of 1 or greater between the loss tangent when the strain amplitude is 10% of the film thickness, versus when the amplitude is 0.1%. Through the use of this resin sheet, there can be provided a semiconductor device that does not give rise to bubbles or cracks in the resin sheet, and that has exceptional reliability of connections. The occurrence of agglomerated matter in this resin composition during storage is minimal. Resin sheets of the resin composition formed to a sheet profile have good flatness. The cured product can provide a circuit board or semiconductor device having exceptional reliability of connections.