| 发明名称 |
POLISHING APPARATUS |
| 摘要 |
A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring. |
| 申请公布号 |
US2014370794(A1) |
申请公布日期 |
2014.12.18 |
| 申请号 |
US201414476680 |
申请日期 |
2014.09.03 |
| 申请人 |
EBARA CORPORATION |
发明人 |
FUKUSHIMA Makoto;YASUDA Hozumi;NAMIKI Keisuke;NABEYA Osamu;TOGASHI Shingo;YAMAKI Satoru |
| 分类号 |
B24B37/32;H01L21/304 |
主分类号 |
B24B37/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing apparatus comprising:
a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring. |
| 地址 |
Tokyo JP |
