发明名称 PHOTONIC SINTERING OF POLYMER THICK FILM COPPER CONDUCTOR COMPOSITIONS
摘要 This invention provides a method for using a polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film copper conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods. The invention also provides a polymer thick film copper conductor composition.
申请公布号 US2014367619(A1) 申请公布日期 2014.12.18
申请号 US201313916759 申请日期 2013.06.13
申请人 E I DU PONT DE NEMOURS AND COMPANY 发明人 SUMMERS JOHN D.
分类号 H01B1/16 主分类号 H01B1/16
代理机构 代理人
主权项 1. A method for forming an electrical conductor in an electrical circuit, comprising: a) providing a substrate; b) providing a polymer thick film copper conductor composition comprising a reducing agent; c) applying said polymer thick film copper conductor composition onto said substrate; and d) subjecting said polymer thick film copper conductor composition to photonic sintering to form said electrical conductor.
地址 Wilmington DE US