| 摘要 |
<p>PROBLEM TO BE SOLVED: To decrease the number of lots in progress, the number of probe cards, and the number of semiconductor testers, and to efficiently conduct a chip test by simultaneously performing alignment and inspection.SOLUTION: A prober system 1 performing an inspection operation for inspecting a plurality of chips 21 by connecting a plurality of terminals (many probes 24 of a probe card 26) connected to a tester 3 to electrode pads of the respective chips 21 using electrode pad coordinate data on the chips 21 after an alignment operation is performed per chip for acquiring the electrode pad coordinate data, is configured so that alignment-specific stage means 2A on which a mounting member 28 mounting thereon the plurality of chips 21 is positioned and mounted and inspection-specific stage means 2B on which a mounting member 28 mounting thereon the plurality of chips 21 transported from the alignment-specific stage means 2A is positioned and mounted are arranged adjacent to each other, and so that an alignment operation and an inspection operation are simultaneously and independently performed on temporal one-to-one basis.</p> |
