DROP IMPACT TESTING METHOD FOR ELECTRONIC COMPONENT, AND DROP IMPACT TESTING DEVICE THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a drop impact testing method for an electronic component and a drop impact testing device therefor, capable of evaluating component strength with excellent reproducibility by reproducing an actual mounting environment for a circuit board on which an electronic component to be tested is mounted.SOLUTION: A drop impact testing device 10 for an electronic component is a device for checking the presence or absence of a fault in the electronic component by making a weight 18 collide with a rear surface of a circuit board 12b on which the electronic component is mounted to distort the circuit board 12b. The drop impact testing device 10 for an electronic component comprises: a stage 14 for placing the circuit board 12b on which the electronic component is mounted; a weight dropping mechanism 20 for dropping the weight 18 onto the rear surface of the circuit board 12b; and a weight bound prevention mechanism 22 for preventing the weight 18 from dropping onto the circuit board 12b again when the weight 18 rebounds after dropping onto the circuit board 12b. A lower side board support member 32 of the stage 14 is provided with a plurality of pins at desired positions so that they are perpendicular to the lower side board support member 32.