Heating and Cooling Unit with Semiconductor Device and Heat Pipe

摘要

Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers heat from its top to its bottom while a heating semiconductor device (which may similarly comprise one or more Peltier devices) transfers heat from its bottom to its top. A heat pipe transfers waste heat from the cooling semiconductor device's bottom to the heating semiconductor device's bottom and waste cold from the heating semiconductor device's bottom to the cooling semiconductor device's bottom.

主权项

1. A method for changing a first measured temperature of a cooling serving surface for a cooling zone of an apparatus and a second measured temperature of a heating serving surface for a heating zone of the apparatus, the method comprising:
transporting waste heat from a bottom of a cooling semiconductor device to a bottom of a heating semiconductor device; transporting waste cold from the bottom of the heating semiconductor device to the bottom of the cooling semiconductor device; and activating the heating and cooling semiconductor devices so that the cooling serving surface and the heating serving surface are operational at a same time.