EPOXY COMPOUND, EPOXY RESIN, CURABLE COMPOUND, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD

摘要

Provided are: an epoxy compound having a low melt viscosity and superior heat resistance and flame retardance of the cured product thereof; an epoxy resin containing same; a curable compound and cured product thereof; and a semiconductor sealing material. The epoxy compound is characterized by having a molecular structure represented by general formula (I) [in the formula, G represents a glycidyl group, and X is a structural site represented by structural formula (x1) or (x2) {in the formula (x1) or (x2), k is an integer from 1 to 3, m is 1 or 2, and Ar is a structural site represented by structural formula (Ar1) or (Ar2) (in formula (3) or (4), G represents a glycidyl group, and p and r are each 1 or 2). When k or m is 2 or greater, the plurality of Ar groups may be the same or different}].