| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip array resistor in which short circuit of adjacent side face electrodes can be prevented by ensuring the bonding strength, and to provide a manufacturing method therefor.SOLUTION: A chip array resistor includes a chip body 110, four pairs of lower electrode arranged on both side of the lower surface of the chip body, and extended to the corner of the chip body, a side face electrode 140 formed by extending the lower electrode to the side face of the chip body, and a resistor interposed between the lower surface of the chip body and the lower electrode, and coupled electrically with the lower electrode via a contact part. When the d1/d2 is 0.5-1.5, the value of h may be 4,300/d1μm or more and 0.24d2+87.26μm or less, where d1 is the width of the side face electrode, d2 is the distance between adjacent side face electrodes, and h is the height of the side face electrode.</p> |
