发明名称 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To achieve a reduction in crosstalk from a ground conductor or a power-supply conductor to a signal conductor, a reduction in power-supply inductance, and high density of wiring.SOLUTION: A printed wiring board 14 includes a power-supply conductor 113, a ground conductor 112, and a plurality of signal conductors 110 and 111. The power-supply conductor 112 and the ground conductor 113 are arranged adjacent to each other in a conductor layer 21 to configure a power-supply conductor group 121, and the two or more signal conductors 110 and 111 are arranged adjacent to each other in the conductor layer 21 to configure a signal conductor group 120. The power-supply conductor group 121 and the signal conductor group 120 are arranged adjacent to each other. When the distance between the two signal conductors 110 and 111 adjacent to each other of the signal conductor group 120 is S, and the distance between the power-supply conductor group 121 and the signal conductor group 120 is S1, the following formula is satisfied: S<S1≤10×S.</p>
申请公布号 JP2014239121(A) 申请公布日期 2014.12.18
申请号 JP20130120090 申请日期 2013.06.06
申请人 CANON INC 发明人 HOSHI SATOSHI;YAMASHITA NOBUTERU;MURAI HIRONORI
分类号 H01L23/12;H05K1/02;H05K3/46 主分类号 H01L23/12
代理机构 代理人
主权项
地址