| 发明名称 |
PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material. |
| 申请公布号 |
US2014369016(A1) |
申请公布日期 |
2014.12.18 |
| 申请号 |
US201214368210 |
申请日期 |
2012.12.12 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
Lim Seol Hee;Jo Yun Kyoung;Kim Ae Rim;Eom Sai Ran;Park Chang Hwa |
| 分类号 |
H05K3/30;H05K1/09;H05K3/18;H05K1/18 |
主分类号 |
H05K3/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board for a memory card, comprising:
an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same metal material. |
| 地址 |
Seoul KR |
