| 摘要 |
Substrate (1) (e.g. DBC, lead frame or semiconductor, in particular Si or SiC), which on the surface has a first region (2) for a soldered connection for at least one component (4), wherein the first region (2) is at least partially delimited by at least one second region (3, 5, 6) on the surface of the substrate (1), and wherein the at least one second region (3, 5, 6) repels solder agent and acts as a soldering resist. The height of the second, solder agent-repelling region (3, 5, 6) is greater or smaller than the height of the first region (2). The second, solder agent-repelling region (3, 5, 6) is produced by physical and/or chemical surface treatment, in particular by oxidation or sulfiding or nitriding of materials containing copper, nickel or silver. After the component (4) has been soldered on, the oxide can be removed again, as a result of which a roughened surface, at which a molding compound, for example, finds a better bond during further processing of the substrate (2), is formed in the second regions (3, 5, 6). |
