STAGE FOR BONDING SUBSTRATES, SUBSTRATE BONDING APPARATUS INCLUDING THEREOF, AND MANUFACTURING METHOD OF DISPLAY DEVICE

摘要

A stage for bonding a substrate includes a base member and an electric field forming part. The base member may be formed with an insulation material. The electric field forming part is inserted to penetrate the base member, and is formed with a conductive material. The electric field forming part includes a stem part and a branch part. The stem part is extended toward a first direction on a plane. The branch part is branched from the stem part and is extended toward a different direction from the first direction. A substrate is fixed on the stage for bonding a substrate, and an adhesive is coated on the substrate in order to correspond to a shape of the electric field forming part. Then, when an electric field is formed using the electric field forming part and the substrate is bonded to another substrate, generation of void in the adhesive can be prevented.