| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate surface processing device in which an applied pressure of a pressure head can be freely controlled and enhancement of processing quality can be achieved.SOLUTION: A pressure head 60, which is provided in a route of a tape 12 supplied from a supply reel 13 and wound around a take-up reel 14 and presses the tape 12 to a substrate 1, is fixed to a pressure head support plate 61. The pressure head support plate 61 is slidably inserted in a guide rod 63 of which both ends are fixed to a generally U-shaped drive plate 62. A support shaft 64 is slidably inserted in a part of the pressure head support plate 61 on a side opposite to the pressure head 60, a pressing plate 65 is fixed to an outer end of the support shaft 64, and an energization spring 66 is provided to the support shaft 64 between the pressure head support plate 61 and the pressing plate 65. The drive plate 62 has a rise-up part 62a to which the pressing plate 65 is pressure-welded, and the rise-up part 62a is provided with a strain gage 68 to which the pressing plate 66 is pressure-welded. The pressure head 60 presses the drive plate 62 to the substrate 1 via the tape 12 by a motor 82. |
