发明名称 |
SYSTEM FOR FORMING A CONDUCTIVE PATTERN |
摘要 |
A system or apparatus for forming a conductive pattern on a substrate (208) includes a thermal imaging head (220) that forms an image pattern on the substrate. A functional material (240) spraying element (224) applies a functional material on the substrate which bonds with the image pattern. The spraying element is integrated in the thermal imaging head. An electro-less deposition element is applied using the electro-less deposition element on the substrate to enhance the functionality of the final product. |
申请公布号 |
US2014366805(A1) |
申请公布日期 |
2014.12.18 |
申请号 |
US201313917924 |
申请日期 |
2013.06.14 |
申请人 |
Schuster Israel |
发明人 |
Schuster Israel |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
1. A system or apparatus for forming a conductive pattern on a substrate comprising:
a thermal imaging head that forms an image pattern on said substrate; a functional material spraying element that applies a functional material on said substrate which bonds with said image pattern wherein said spraying element is integrated in said thermal imaging head; and an electro-less deposition element wherein a deposition process is applied using said electro-less deposition element on said substrate to enhance the functionality of the final product. |
地址 |
Kiriyat Tivon IL |