发明名称 SYSTEM FOR FORMING A CONDUCTIVE PATTERN
摘要 A system or apparatus for forming a conductive pattern on a substrate (208) includes a thermal imaging head (220) that forms an image pattern on the substrate. A functional material (240) spraying element (224) applies a functional material on the substrate which bonds with the image pattern. The spraying element is integrated in the thermal imaging head. An electro-less deposition element is applied using the electro-less deposition element on the substrate to enhance the functionality of the final product.
申请公布号 US2014366805(A1) 申请公布日期 2014.12.18
申请号 US201313917924 申请日期 2013.06.14
申请人 Schuster Israel 发明人 Schuster Israel
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项 1. A system or apparatus for forming a conductive pattern on a substrate comprising: a thermal imaging head that forms an image pattern on said substrate; a functional material spraying element that applies a functional material on said substrate which bonds with said image pattern wherein said spraying element is integrated in said thermal imaging head; and an electro-less deposition element wherein a deposition process is applied using said electro-less deposition element on said substrate to enhance the functionality of the final product.
地址 Kiriyat Tivon IL