FILM-LIKE ADHESIVE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a film-like adhesive which enables coping with a flip chip connection system and a method of producing a semiconductor device using the adhesive.SOLUTION: A film-like adhesive comprises (a) a resin of a weight average molecular weight of 10,000 or smaller being solid at ordinary temperature, (b) an insulating spherical inorganic filler, (c) an epoxy resin and (d) a hardener and has a minimum melt viscosity in the temperature range of 50-250°C of higher than 200 Pa s, a flow rate, or the ratio of the initial area of the film-like agent sandwiched between parallel plates when heated and pressurized in the temperature range of 50-150°C to the area after the heating and pressurization, of 1.5 or higher and a mean coefficient of linear expansion in the temperature range of 25-260°C of 200×10/°C or smaller. (d) The hardener contains an imidazole having a melting point or a decomposition point of equal to or higher than 150°C and a micro-capsulated hardener.