| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging apparatus which reduces loads applied to an image pickup device and a substrate on which the image pickup device is mounted and realizes downsizing and thickness reduction of a device body and heat radiation performance. ! SOLUTION: A monitor camera 1 includes: a lens barrel unit 201; an imaging printed circuit board 301 on which an image pickup device 301-a is mounted; a metal member 302 which is disposed closer to the opposite side of the object side than the imaging printed circuit board 301; and a flexible heat radiation member 303 which is disposed between the imaging printed circuit board 301 and the metal member 302. The metal member 302 is formed into an arc shape. The heat radiation member 303 includes: a first adhesive part 303-a located at a position corresponding to the image pickup device 301-a; and a second adhesive part 303-b located at a position corresponding to an end part of the metal member 302. ! COPYRIGHT: (C)2015,JPO&INPIT |
