| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conduction structure capable of preventing the deterioration of heat insulation performance of a heat insulation vacuum tank which is caused by degasification, and to provide a superconductive device cooling device using the heat conduction structure. ! SOLUTION: A superconductive device cooling device includes: an ultralow temperature part 31 of a refrigerator 3; a cooled body 2 on which a superconductive device 1 is mounted; a heat insulation vacuum tank 4 which stores the cooled body 2; a heat insulation support member 5 which supports the cooled body 2 on an inner wall of the heat insulation vacuum tank 4; and a heat conduction structure 6 which absorbs vibrations generated by the refrigerator 3 by using a metal material for thermally coupling the ultralow temperature part 31 to the cooled body 2. The heat conduction structure 6 is covered by a cover material having a feature that absorbs a gas generated by the metal material being stored in the heat insulation |
