COMPLEX HEAT DISSIPATION ASSEMBLY FOR ELECTRONIC CASE

摘要

A complex heat dissipation assembly for electronic case, which includes: a heat conduction plate assembly composed of multiple electroconductive heat conduction plates, the heat conduction plate assembly having a contact face in contact with a surface of the case; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly transversely conduct heat. The heat spreaders are disposed between the heat conduction plates in contact therewith. Each heat spreader has a proximal-to-heat-source section and a distal-from-heat-source section. The heat conduction plate assembly and the heat spreader assembly cooperate with each other to complexly conduct and spread the heat of the case in different directions so as to uniformly and quickly dissipate the heat. Accordingly, the heat is prevented from accumulating around the case and the temperature will not locally abnormally rise.

主权项

1. A complex heat dissipation assembly for electronic case, comprising:
a case at least partially housing a heat source; a heat conduction plate assembly composed of multiple stacked electroconductive heat conduction plates; and a heat spreader assembly composed of multiple heat spreaders, which are able to quickly conduct heat along the surface, the heat spreaders being alternately disposed between the heat conduction plates, each of the heat spreaders having a proximal-to-heat-source section proximal to the case and a distal-from-heat-source section extending in a direction away from the case, at least one of the heat conduction plate assembly and the heat spreader assembly being in contact with a surface of the case.