发明名称 |
HIGH-DENSITY RACK UNIT SYSTEMS AND METHODS |
摘要 |
High-density rack unit systems and methods are described for telecommunication and data communication systems that utilize novel airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The high-density rack unit systems and methods offer novel airflow mechanisms via right-angle backplane connectors to enable more airflow in a rack unit as well as novel field replaceable fans in these high-density rack units. Further, the high-density rack unit systems and methods include a baffle structure to keep power-supply-related airflow separate from the airflow over other components in the 1U or 2U rack unit. In this manner, the high-density rack unit systems and methods enable system vendors and network operators to realize significant density improvements. |
申请公布号 |
US2014369001(A1) |
申请公布日期 |
2014.12.18 |
申请号 |
US201313916164 |
申请日期 |
2013.06.12 |
申请人 |
Miller Daniel L.;Hotchkiss Adam R. |
发明人 |
Miller Daniel L.;Hotchkiss Adam R. |
分类号 |
H05K5/02;H05K7/20;H05K7/14 |
主分类号 |
H05K5/02 |
代理机构 |
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代理人 |
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主权项 |
1. A rack unit system, comprising:
a physical housing comprising a front side, a back side, a left side, and a right side, wherein the left side and the right side are configured to connect to a rack; bottom-plane connections located at or near the back side, wherein the bottom-plane connections interface to right-angle connections on associated bottom-plane circuit boards connecting the associated circuit boards therebetween, and wherein the associated bottom-plane circuit boards are in a horizontal plane inside the physical housing; and a plurality of openings in the back side located in substantially unobstructed portions of the back side thereby enabling airflow through the physical housing. |
地址 |
Plano TX US |