| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve quality of a semiconductor wafer.SOLUTION: At the time when an insert paper 2 is picked up from a wafer tray 3 in which the insert paper 2 and a wafer 1 are alternately stacked, the insert paper 2 is pressed and bent below a suction surface 6a of a suction head 6 by a first arm 5aa when the suction head 6 which is sucking the insert paper 2 is moved upward. If a wafer sticks, the wafer 1 is pressed down by the first arm 5aa, to be separated from the insert paper 2, to return into the wafer tray 3. Thus, the wafer 1 is prevented from dropping from a high position, resulting in formation of a micro crack on the wafer 1.</p> |
