发明名称 |
POLISHING LIQUID FOR METAL AND POLISHING METHOD |
摘要 |
The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability. |
申请公布号 |
US2014370707(A1) |
申请公布日期 |
2014.12.18 |
申请号 |
US201314376382 |
申请日期 |
2013.01.29 |
申请人 |
Hitachi Chemical Company, Ltd. |
发明人 |
Ichige Yasuhiro;Haga Kouji;Kondo Seiichi |
分类号 |
H01L21/321;C09K3/14 |
主分类号 |
H01L21/321 |
代理机构 |
|
代理人 |
|
主权项 |
1. A metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising
component A: a metal solubilizer containing an amino acid; component B: a compound having the benzotriazole skeleton; and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, wherein the mass ratio between the component B and the component C, (component B:component C), is 1:1 to 1:5. |
地址 |
Chiyoda-ku, Tokyo JP |