发明名称 POLISHING LIQUID FOR METAL AND POLISHING METHOD
摘要 The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.
申请公布号 US2014370707(A1) 申请公布日期 2014.12.18
申请号 US201314376382 申请日期 2013.01.29
申请人 Hitachi Chemical Company, Ltd. 发明人 Ichige Yasuhiro;Haga Kouji;Kondo Seiichi
分类号 H01L21/321;C09K3/14 主分类号 H01L21/321
代理机构 代理人
主权项 1. A metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising component A: a metal solubilizer containing an amino acid; component B: a compound having the benzotriazole skeleton; and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, wherein the mass ratio between the component B and the component C, (component B:component C), is 1:1 to 1:5.
地址 Chiyoda-ku, Tokyo JP