发明名称 |
LIGHT-EMITTING DEVICE |
摘要 |
A light-emitting device comprises: a light-emitting stack having an upper side, a first edge having an end point, and a second edge opposite to the first edge; a first bonding region arranged on the upper side, near the first edge, and far from the end point; a second bonding region separated from to the first bonding region by a first distance and being far from the end point; a third bonding region arranged on the upper side; a fourth bonding region separated from the third bonding region by a second distance longer than the first distance; a first electrode connected to the first bonding region; a second electrode connected to the second bonding region; a third electrode connected to the third bonding region; a fourth electrode connected to the fourth bonding region; and a fifth electrode connected to the first bonding region and pointing to the fourth bonding region. |
申请公布号 |
US2014367733(A1) |
申请公布日期 |
2014.12.18 |
申请号 |
US201414474633 |
申请日期 |
2014.09.02 |
申请人 |
Epistar Corporation |
发明人 |
SHEN Chien-Fu;Kuo Cheng-Ta;Chen Wei-Shou;Liu Tsung-Hsien;Ku Yi-Wen;Hsieh Min-Hsun |
分类号 |
H01L33/38;H01L23/00 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
1. A light-emitting device comprising:
a light-emitting stack having an upper side, a first edge having an end point, and a second edge opposite to the first edge; a first bonding region arranged on the upper side, near the first edge, and far from the end point; a second bonding region separated from to the first bonding region by a first distance and being far from the end point; a third bonding region arranged on the upper side; a fourth bonding region separated from the third bonding region by a second distance longer than the first distance; a first electrode connected to the first bonding region; a second electrode connected to the second bonding region; a third electrode connected to the third bonding region; a fourth electrode connected to the fourth bonding region; and a fifth electrode connected to the first bonding region and pointing to the fourth bonding region. |
地址 |
Hsinchu TW |