发明名称 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE
摘要 The method for fabricating a semiconductor device is to fabricate a semiconductor device including GaN (gallium nitride) that composes a semiconductor layer and includes a step of forming a gate insulating film. In the step, at least one film selected from the group consisting of a SiO2 film and an Al2O3 film is formed on a nitride layer containing GaN by using microwave plasma and the formed film is used as at least a part of the gate insulating film.
申请公布号 US2014367699(A1) 申请公布日期 2014.12.18
申请号 US201414474835 申请日期 2014.09.02
申请人 TOHOKU UNIVERSITY ;FUJI ELECTRIC CO., LTD. ;TOKYO ELECTRON LIMITED 发明人 TERAMOTO Akinobu;KAMBAYASHI Hiroshi;UEDA Hirokazu;MOROZUMI Yuichiro;HARADA Katsushige;HASEBE Kazuhide;OHMI Tadahiro
分类号 H01L21/02;H01L29/20;H01L29/205;H01L21/28;H01L23/00;H01L29/51;H01L29/778 主分类号 H01L21/02
代理机构 代理人
主权项 1. A semiconductor device including GaN that composes a semiconductor layer comprising: a nitride layer containing GaN that composes the semiconductor layer; and a gate insulating film formed on the nitride layer, wherein the gate insulating film includes at least one film selected from the group consisting of a SiO2 film formed by using microwave plasma generated with microwaves at a frequency of 2.45 GHz by using a radial line slot antenna and an Al2O3 film formed with microwave plasma generated with microwaves at a frequency of 2.45 GHz by using the radial line slot antenna.
地址 Sendai-shi JP