WARP COMPENSATED ELECTRONIC ASSEMBLIES

摘要

An electronic panel assembly (EPA) includes one or more electronic devices with primary faces having electrical contacts, opposed rear faces and edges therebetween. The devices are mounted primary faces down in openings in a warp control sheet (WCS). Cured plastic encapsulation is formed at least between lateral edges of the devices and WCS openings. Undesirable panel warping during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. Thin film insulators and conductors couple electrical contacts on various devices to each other and to external terminals, thereby forming an integrated multi-device EPA.

主权项

1. An integrated electronic assembly, comprising:
multiple electronic devices having front faces with bonding pads thereon, opposed rear faces and edges extending between the front and rear faces; a substantially planar sheet having openings therein in which the multiple electronic devices are located and wherein the substantially planar sheet has a first coefficient of thermal expansion (CTE); plastic encapsulation in at least the openings in the substantially planar sheet coupling the electronic devices to the substantially planar sheet so that an initial electronic assembly is formed with the bonding pads exposed, wherein the plastic encapsulation has a second CTE relative to the first CTE such that the initial electronic assembly is substantially flat or has a convex warp; and interconnections extending to some of the multiple electronic devices of the initial electronic assembly thereby coupling some of the bonding pads to each other or to external terminals or both to form the integrated electronic assembly.