Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials

摘要

According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat generating components using thermoplastic and/or self-healing thermal interface materials. In an exemplary embodiment, a thermal interface material has a softening or melting temperature above a normal operating temperature of the one or more heat generating components. The thermal interface material is flowable to a thin bond line between a heat spreader or lid and one or more heat generating components when heated to at least the softening or melting temperature while under pressure.

主权项

1. A method of establishing a thermal joint for conducting heat between an integrated heat spreader or lid and one or more heat generating components of an electronic device, the method comprising:
positioning a thermoplastic thermal interface material between the integrated heat spreader or lid and the one or more heat generating components, the thermoplastic thermal interface material having a softening or melting temperature above a normal operating temperature of the one or more heat generating components; heating the thermoplastic thermal interface material to at least the softening or melting temperature while under pressure such that the thermoplastic thermal interface material flows to form a thin bond line between the integrated heat spreader or lid and the one or more heat generating components; and allowing the thermoplastic thermal interface material to return to a solid state, whereby the thermoplastic thermal interface material establishes a thermal joint between the integrated heat spreader or lid and the one or more heat generating components.