| 发明名称 |
POLISHING LIQUID FOR CMP, AND POLISHING METHOD |
| 摘要 |
Provided is a polishing liquid for CMP, which contains abrasive grains that contain a cerium-based compound, a 4-pyrone-based compound, a polymeric molecule having an aromatic ring and a polyoxyalkylene chain, a cationic polymer, and water. |
| 申请公布号 |
WO2014199739(A1) |
申请公布日期 |
2014.12.18 |
| 申请号 |
WO2014JP61847 |
申请日期 |
2014.04.28 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
OOTA MUNEHIRO;TAKIZAWA TOSHIO;MINAMI HISATAKA;AKUTSU TOSHIAKI;IWANO TOMOHIRO |
| 分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
