| 摘要 |
PROBLEM TO BE SOLVED: To inhibit peeling of a part of a solder resist, which is located on an edge of a wiring board after singulation when wiring boards are manufactured by singulation.SOLUTION: A semiconductor device comprises a wiring board IP which is rectangular and has a plurality of first terminals FNG1, first wiring INC11, a solder resist layer SR, and a plurality of vias VA. The plurality of first terminals FNG1 are provided along a first side SID1 of a chip mounting surface. The solder resist layer SR covers the first wiring INC11 and the vias VA and has an opening SRO. The SRO includes the plurality of first terminals FNG1 inside and connected to the first side SID1. |
