THICK RAISED PRINT COPPER PASTE FOR ALUMINUM NITRIDE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an electroconductive paste composition exhibiting excellent contact characteristic when applied to an aluminum nitride substrate.SOLUTION: There is provided an electroconductive paste containing 50 to 90 wt.% of copper particle, 0.5 to 10 wt.% of glass frit, 0.1 to 5 wt.% of a contact enhancer which is at least a member selected from a group consisting of cuprous oxide, titanium oxide, zirconium oxide, resinated boron, resinated zirconium, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide and zinc oxide, and 5 to 20 wt.% of an organic vehicle.