| 主权项 |
1. A method of forming a component-embedded printed circuit board, comprising:
preparing a first layered structure that includes a first insulator layer and a patterned first metal-foil layer that is disposed on the first insulator layer and that has a plurality of spaced apart first foil traces, the first layered structure having a mounting side that has a build-up region and at least one mounting region, at least one of the first foil traces being disposed at the mounting region; preparing a second layered structure that includes a second metal-foil layer, a second insulator layer, an adhesive film of a thermosetting material, and a releasable film, which are stacked one above another in the above order; attaching the second layered structure to the first layered structure to form a build-up layered stack, the adhesive film contacting and covering the build-up region of the first layered structure, the releasable film releasably contacting and covering the mounting region of the first layered structure; heating and pressing the build-up layered stack, such that the adhesive film is formed into a cured thermoset adhesive film that adhesively bonds the build-up region of the first layered structure and the second layered structure; cutting the second layered structure through the second insulator layer and the cured thermoset adhesive film along a cutting path, which is registered with a periphery of the releasable film, after the heating and pressing; removing the releasable film together with a cut portion of the second insulator layer and a cut portion of the cured thermoset adhesive film, that are stacked on the releasable film, from the mounting region of the mounting side of the first layered structure after the cutting so as to form a component-embedding hole in the second layered structure to expose the mounting region; and disposing an electronic component in the component-embedding hole. |
