| 发明名称 |
METHOD OF FABRICATING A SOLDER PARTICLE |
| 摘要 |
Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles. |
| 申请公布号 |
US2014367375(A1) |
申请公布日期 |
2014.12.18 |
| 申请号 |
US201314089442 |
申请日期 |
2013.11.25 |
| 申请人 |
Electronics and Telecommunications Research Institute |
发明人 |
BAE Hyun-cheol;EOM Yong Sung;CHOI KWANG-SEONG;LEE Haksun |
| 分类号 |
H05B6/00 |
主分类号 |
H05B6/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a solder particle, the method comprising:
adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process; disposing the first container in a second container including a second magnetic bar; operating the first magnetic bar and the second magnetic bar; and applying heat to the first container to melt the first solder particles. |
| 地址 |
Daejeon KR |
