COMPOUND CONTAINING PHENOLIC HYDROXYL GROUP, PHENOLIC RESIN, CURABLE COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, AND PRINTED CIRCUIT BOARD

摘要

Provided are: a compound containing a phenolic hydroxyl group and having superior heat resistance and flame retardance of the cured product thereof; a phenolic resin containing same; a curable composition and cured product thereof; a semiconductor sealing material; and a printed circuit board. The phenolic resin is characterized by containing, as required components, a binuclear compound (X) represented by structural formula (I) [in the formula: j and k are each 1 or 2; and at least one of j and k is 2] and a trinuclear compound (Y) represented by structural formula (II) [in the formula: l, m, and n are each 1 or 2; and at least one of l, m, and n is 2].