METHOD FOR MANUFACTURING WIRING BOARD

摘要

A method for manufacturing a wiring board in which portions of connection pads (3) are exposed from a solder resist layer (2) on the surface of a circuit board (1), said method for manufacturing a wiring board including: (A) a step in which a solder resist layer is formed on the surface of a circuit board; (C1) a step in which portions of the solder resist layer other than the areas to be thinned in step (B1), which is a subsequent step, are exposed; (B1) a step in which the solder resist layer at the non-exposed portions is thinned by way of a thin film processing solution to an extent in which the connection pads are not exposed;(C2) a step in which portions of the solder resist layer other than areas to be thinned in step (B2), which is a subsequent step, are exposed; (B2) a step in which the solder resist layer at the non-exposed portions is thinned by way of the thin film processing solution until having a thickness less than or equal to the thickness of the connection pads so that a portion of the connection pad is exposed; and (C5) a step in which the portions of the areas of the solder resist layer thinned in step (B2) are exposed.