发明名称 ATTACHMENT OF WAFER LEVEL OPTICAL ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive camera module effectively manufactured.SOLUTION: A method for assembling camera modules includes attaching optical elements, such as an optics stack, directly to an upper surface of an image sensor. A housing is arranged to partially surround the optics stack. Alternatively, the housing is formed by a transfer molding process. This technique can be applied in an array processing condition and solder balls can be attached to a bottom of the image sensor, thereby the camera module, which is efficiently manufactured and inexpensive, is provided.
申请公布号 JP2014238596(A) 申请公布日期 2014.12.18
申请号 JP20140151679 申请日期 2014.07.25
申请人 DIGITALOPTICS CORP 发明人 HARPUNEET SINGH;IRMINA CARPIO;YEOW GUAN HOCK
分类号 G02B7/02;G03B17/02;H01L27/14;H04N5/225 主分类号 G02B7/02
代理机构 代理人
主权项
地址