发明名称 Gate Insulator Loss Free Etch-Stop Oxide Thin Film Transistor
摘要 A method is provided for fabricating a thin-film transistor (TFT). The method includes forming a semiconductor layer over a gate insulator that covers a gate electrode, and depositing an insulator layer over the semiconductor layer, as well as etching the insulator layer to form a patterned etch-stop without losing the gate insulator. The method also includes forming a source electrode and a drain electrode over the semiconductor layer and the patterned etch-stop. The method further includes removing a portion of the semiconductor layer beyond the source electrode and the drain electrode such that a remaining portion of the semiconductor layer covers the gate insulator in a first overlapping area of the source electrode and the gate electrode and a second overlapping area of the drain electrode and gate electrode.
申请公布号 US2014370655(A1) 申请公布日期 2014.12.18
申请号 US201414474433 申请日期 2014.09.02
申请人 Apple Inc. 发明人 Hung Ming-Chin;Kim Kyung Wook;Park Young Bae;Chiu Hao-Lin;Huang Chun-Yao;Chang Shih Chang
分类号 H01L29/66;H01L29/423;H01L29/786 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method of fabricating a thin-film transistor (TFT), the method comprising: forming a semiconductor layer over a gate insulator that covers a gate electrode; depositing an insulator layer over the semiconductor layer; and etching the insulator layer to form a patterned etch-stop without losing the gate insulator. forming a source electrode and a drain electrode over the semiconductor layer and the patterned etch-stop; and removing a portion of the semiconductor layer beyond the source electrode and the drain electrode such that a remaining portion of the semiconductor layer covers the gate insulator in a first overlapping area of the source electrode and the gate electrode and a second overlapping area of the drain electrode and gate electrode.
地址 Cupertino CA US