发明名称 |
Gate Insulator Loss Free Etch-Stop Oxide Thin Film Transistor |
摘要 |
A method is provided for fabricating a thin-film transistor (TFT). The method includes forming a semiconductor layer over a gate insulator that covers a gate electrode, and depositing an insulator layer over the semiconductor layer, as well as etching the insulator layer to form a patterned etch-stop without losing the gate insulator. The method also includes forming a source electrode and a drain electrode over the semiconductor layer and the patterned etch-stop. The method further includes removing a portion of the semiconductor layer beyond the source electrode and the drain electrode such that a remaining portion of the semiconductor layer covers the gate insulator in a first overlapping area of the source electrode and the gate electrode and a second overlapping area of the drain electrode and gate electrode. |
申请公布号 |
US2014370655(A1) |
申请公布日期 |
2014.12.18 |
申请号 |
US201414474433 |
申请日期 |
2014.09.02 |
申请人 |
Apple Inc. |
发明人 |
Hung Ming-Chin;Kim Kyung Wook;Park Young Bae;Chiu Hao-Lin;Huang Chun-Yao;Chang Shih Chang |
分类号 |
H01L29/66;H01L29/423;H01L29/786 |
主分类号 |
H01L29/66 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of fabricating a thin-film transistor (TFT), the method comprising:
forming a semiconductor layer over a gate insulator that covers a gate electrode; depositing an insulator layer over the semiconductor layer; and etching the insulator layer to form a patterned etch-stop without losing the gate insulator. forming a source electrode and a drain electrode over the semiconductor layer and the patterned etch-stop; and removing a portion of the semiconductor layer beyond the source electrode and the drain electrode such that a remaining portion of the semiconductor layer covers the gate insulator in a first overlapping area of the source electrode and the gate electrode and a second overlapping area of the drain electrode and gate electrode. |
地址 |
Cupertino CA US |