| 摘要 |
[PROBLEMS TO BE SOLVED] A thermally conductive, electrically conductive adhesive composition having high thermal conductivity and consistent electrical conductivity for use as a die-bonding material is provided. [SOLUTION] A thermally conductive, electrically conductive adhesive composition including:
(A) an electrically conductive filler,
(B) an epoxy resin, and
(C) a curing agent,
the electrically conductive filler (A) being a submicron fine silver powder, and the content of the fine silver powder being 75 to 94% by mass of the total amount of the thermally conductive, electrically conductive adhesive composition,
the content of the epoxy resin (B) being 5 to 20% by mass of the total amount of the thermally conductive, electrically conductive adhesive composition,
the curing agent (C) being a compound of Formula (I), (II), or (III), and the content of the compound being 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B), and
during heat curing and before the electrically conductive filler (A) starts to sinter, the thermally conductive, electrically conductive adhesive composition being in an uncured state or a half-cured state:
(in which X is -SO 2 -, -CH 2 -, or -O-, and R1 to R4 are independently a hydrogen atom or a lower alkyl group),
(in which X is -SO 2 -, -CH 2 -, or -O-, and R5 to R8 are independently a hydrogen atom or a lower alkyl group), and
(in which X is -SO 2 -, -CH 2 -, or -O-, and R9 to R12 are independently a hydrogen atom or a lower alkyl group). |
