发明名称 半導体発光素子用基板の製造方法及びそれを用いた半導体発光素子
摘要 A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.
申请公布号 JP5641025(B2) 申请公布日期 2014.12.17
申请号 JP20120175746 申请日期 2012.08.08
申请人 发明人
分类号 H01L33/22;H01L21/205;H01L33/32;H01L33/60;H01L33/62 主分类号 H01L33/22
代理机构 代理人
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