| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board, having improved ion migration resistance between adjacent signal lines with added contrivance on a wiring pattern. SOLUTION: The multilayer wiring board includes multilayer wiring having a plurality of wiring layers alternately laminated with interlayer insulation layers that are composed of an insulation resin disposed between the wiring layers. A wiring layer placed in the outermost layer of the wiring layers further includes a semiconductor mounting portion for mounting a semiconductor to be connected to a signal line. In the multilayer wiring board, a wiring layer on the outermost layer of the wiring layers includes a plurality of signal lines 1 (1A, 1B). The plurality of signal lines include signal lines 1A having convex-shaped convex portions 2 formed in a direction close to other adjacent signal lines 1B. The contour of each convex portion 2 is bordered with a curve. The curve is formed of a circular arc having a predefined curvature. COPYRIGHT: (C)2012,JPO&INPIT |
