| 摘要 |
The present technology relates to a signal processing device which can reduce a manufacturing cost. An electronic apparatus includes a semiconductor chip as a plurality of signal processing circuits. The semiconductor chip includes an input/output circuit (I/O) configured by one or both of an input circuit which functions as an input interface of a signal occupying a predetermined frequency band, and an output circuit which functions as an output interface of the signal occupying the predetermined frequency band. The signal occupying the predetermined frequency band is transmitted between the semiconductor chip and another semiconductor chip. The signal occupying the predetermined frequency band can be transmitted between the input/output circuit of one semiconductor chip and the input/output circuit of another semiconductor chip through any of a plurality of transmission media having different characteristics such as a metallic wire, a dielectric waveguide, and free space. The present technology can be applied to an electronic apparatus configured by a plurality of semiconductor chips, for example. |
