| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a first mold resin 130 from flowing out from a mounting region Rm of a wiring board 110 without using a resin dam sheet when the first mold resin 130 is injected into the mounting region Rm of the wiring board 110 so as to cover an LED chip Lc. <P>SOLUTION: A light emitting device 100 is formed by sealing an LED chip Lc in a package. In the light emitting device 100, a wiring board 110 forming the package has a protruding part 110a formed around a mounting region Rm on its surface where the LED chip Lc is disposed so as to dam the first mold resin 130 sealing the LED chip Lc. <P>COPYRIGHT: (C)2013,JPO&INPIT |
