发明名称 金属セラミック基板
摘要 <p>A metal/ceramic substrate made up of a multilayer, plate-shaped ceramic material and at least one metallization provided on a surface side of the ceramic material. The at least one metallization is bonded to the ceramic material by direct copper bonding or reactive brazing and the ceramic material is made of a base layer made of silicon nitride ceramic. The at least one metallization is formed from at least one intermediate layer of an oxidic ceramic applied to the at least one base layer.</p>
申请公布号 JP5641451(B2) 申请公布日期 2014.12.17
申请号 JP20120502447 申请日期 2010.03.26
申请人 发明人
分类号 C04B41/90;C04B35/584;C04B37/02 主分类号 C04B41/90
代理机构 代理人
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