发明名称 硬化性オルガノポリシロキサン組成物及び半導体装置
摘要 <p>A curable organopolysiloxane composition in grease or paste form, which including: (A) an organopolysiloxane having at least two alkenyl groups bonded to silicon atom in one molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicone atom in the molecule; (C) gallium and/or a gallium alloy having a melting point of 0 to 70° C.; (D) a thermally conductive filler having an average particle size of 0.1 to 100μm; (E) a platinum-based catalyst; and (F) a polysiloxane of the following general formula (1): wherein R1 may be the same or different and represents a monovalent hydrocarbon group, R2 represents an alkyl group, an alkoxyl group, an alkenyl group or an acyl group, a is an integer of 5 to 100, and b is an integer of 1 to 3.</p>
申请公布号 JP5640945(B2) 申请公布日期 2014.12.17
申请号 JP20110223905 申请日期 2011.10.11
申请人 发明人
分类号 C08L83/14;C08K3/08;C08K3/22;C08K5/5419;C08L83/05;H01L23/36;H01L23/373 主分类号 C08L83/14
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