| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer which exhibits excellent high frequency characteristics while simplifying the manufacturing process. SOLUTION: A through electrode 12 is provided through a substrate 11, a dielectric layer 14A is formed on the substrate 11 and then interconnections 16A and 16B and an antenna 17 are formed on the dielectric layer 14A. Subsequently, dielectric layers 14 and 14C are laminated, respectively, on the undersurface of the substrate 11 and on the dielectric layer 14A, and a recess 19A is provided in the substrate 11 thus completing an interposer 10A. After bonding a semiconductor chip 20 to the top face side of the substrate 11, the undersurface side of the substrate 11 is mounted on a printed board 30. Since the interconnections 16A and 16B for connecting the semiconductor chip 20 and the printed board 30 are provided on the substrate 11, the manufacturing process is simplified. COPYRIGHT: (C)2012,JPO&INPIT |
