| 摘要 |
PROBLEM TO BE SOLVED: To improve bonding strength between an electrode and a ceramic layer, and to secure excellent attaching properties of plating without causing substrate cracking etc. SOLUTION: A method of manufacturing a ceramic electronic component includes: a conductive paste-manufacturing step of manufacturing conductive paste including at least conductive powder, non-glassy inorganic oxide, and an organic vehicle; a molding body-manufacturing step of manufacturing a molding body by molding and processing a ceramic material including an amorphous glass component; a conductive film-forming step of forming a conductive film by coating a surface of the molding body with the conductive paste; and a burning step of simultaneously burning the conductive film, which becomes a surface electrode 7 after being burnt, and the molding body, which becomes the ceramic layer 1e after being burnt, and reacting the glass component and inorganic oxide with each other to form a reaction layer 8 between the surface electrode 7 and the ceramic layer 1e, wherein the basicity differenceΔB, between basicity B1 of the inorganic oxide and basicity B2 of a glass component, satisfies 0.02≤ΔB≤1.33. COPYRIGHT: (C)2011,JPO&INPIT |
