| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curing agent for a thermosetting resin giving a cured material having sufficiently high glass transition temperature and sufficiently suppressed color, a thermosetting resin composition produced by using the curing agent, a method for producing the curing agent, a cured material obtained by curing the thermosetting resin composition, and a semiconductor device sealed with the cured material. <P>SOLUTION: The curing agent for the thermosetting resin contains one or more compounds selected from (A) a condensed polyvalent carboxylic acid obtained by condensation reaction of a monocarboxylic acid compound having one carboxyl group and expressed by general formula R1-COOH, or a monocarboxylic acid compound having one carboxyl group and expressed by general formula R1-COOH and a polyvalent carboxylic acid compound having ≥3 carboxyl groups and expressed by general formula R2-(-COOH)n, and (B) a polyvalent carboxylic acid compound having ≥3 carboxyl groups and expressed by general formula R2-(-COOH)n. <P>COPYRIGHT: (C)2010,JPO&INPIT |
